Oct. 23,2024,Adaps Photonics and Lumotive unveil the MD42 Development Kit: Boosting 3D Sensing Innovation.This collaboration represents a significant leap forward in solid-state LiDAR.

Adaps Photonics and HASCO's Automotive Electronics Subsidiary have collaborated to develop a core sensor, the all-solid-state LiDAR, achieving a significant breakthrough in the application of core chips (such as SPAD chips).

3D sensor chip and solution provider Adaps Photonics completed a C2 round funding, The funds from this round of financing will be continuously used for the rapid iteration and mass production of high-end 3D camera chips.

Adaps is releasing an encouraging technology of 3D-stacking SPADIS(SPAD Image Sensor) chip with high resolution and best ranging performance in solid-state LiDAR, the ADS6311.

Recently, 3D sensor chip and solution provider Adaps Photonics completed a C+ round funding of 15 million USD, with investors including Stonevc and Spring Venture Capital, while Lighthouse Capital acted as the exclusive financial advisor.

On November 16th, the Snapdragon 8 Gen 2 processor and "Director Mode" was officially unveiled at the Qualcomm Snapdragon Technology Summit. Director mode is created by Qualcomm in collaboration with Adaps Photonics and Arcsoft for Android.

From June 13th to 15th 2022, the 3rd International SPAD Sensor Workshop (ISSW) was successfully held online. More than 40 well-known scholars and engineers in the field of single photon detection were invited to share speech on this conference.

Adaps photonics has launched a dToF module solution with Ofilm microelectronics.