The dToF single photon imaging sensor ADS6303, codenamed Woodpecker, is released by Adaps Photonics. With a physical resolution of 240 x 160, an area array size of 0.35 inches, and backside illuminated 3D stacking process, the measurement distance of ADS6303 can be up to 15 meters in the indoor environment and 5 meters in the outdoor. Frame rate can go up to 50 fps, which enables the ranging accuracy and depth resolution of sub-centimeter level in full range. ADS6303 meets the needs of smart phones, AR devices, robot vacuum, AIOT, and industrial measurement inclusively. Based on this chip, Adaps has also launched a dToF module solution with Ofilm microelectronics.
It is reported that Adaps ADS6303 is the first dToF sensor chip using 3D stacking technology in China. 3D stacking technology allows a BSI sensor array die(photon detector SPAD part) Cu-Cu hybrid-bonded to a custom DSP die(the logic circuit part). This design can make the chip obtain larger detector/circuit areas without increasing the area occupation, allowing the photon detector and logic circuit to adopt their most suitable process node respectively, to achieve higher SPAD PDE(the photon detection efficiency), higher resolution, lower power consumption and better comprehensive performance.
In the past, this technology was only found in the LiDAR scanner sensor jointly developed by Apple and Sony for iPad pro and iPhone 12 pro. Adaps photonics ADS6303 has exceeded on the level of resolution and ranging capability.
Zang Kai, CEO of Adaps Photonics, says that Adaps has invested in the research and development of 3D stacking technology for more than two years. As one of the few companies in the world and the only company in China that can provide mature high-performance dToF chips and solutions based on BSI 3D stacking technology, Adaps Photonics hopes to help customers start the leap from 2D imaging to 3D perception.